iNDT&E 2019, October 30 – November 1, 2019, Shanghai, China

The 2019 international, intelligent, innovative nondestructive testing and evaluation (iNDT&E 2019) conference provided platform and opportunity to all delegates, including scholars, experts, researchers and technicians to meet each other and consider ‘today and tomorrow’ testing technologies. There were in fact wonderful technology and academic reports from domestic and international experts.
Ostec specialists presented a report on “Acoustic and Raman microscopy as methods of NDT”, which was a success and opened up a long and serious discussion.

particularly presentation of tensile unit for acoustic microscope AMOS leads to large interest of the conference. This solution gives unique possibility to in-situ studying microstructure of bulk samples under load.